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Key Specs Summary(34)
- Core Architecture
- ARM
- Data Bus Width
- 32b
- frequency
- 72MHz
- height
- 1.085mm
- interface
- I2C, SPI, USB, CAN, IrDA, UART, USART, LIN, I2S
- Lead Free
- Lead Free
- length
- 10.15mm
- Max Frequency
- 72MHz
- Max Power Dissipation
- 434mW
- Max Supply Voltage
- 3.6V
- Memory Size
- 128KB
- Memory Type
- FLASH,
- Min Supply Voltage
- 2V
- Operating Temperature Max
- 85°C
- Operating Temperature Min
- -40°C
- Package Case
- LFBGA, BGA100,10X10,32
- Lifecycle Status
- Active
- Number Of Adc Channels
- 16
- Number Of I2 C Channels
- 2
- Number Of I Os
- 80
- Number Of Programmable I O
- 80
- Number Of Spi Channels
- 3
- Number Of Timers Counters
- 7
- Oscillator Type
- Internal
- package
- LFBGA, BGA100,10X10,32
- Package Quantity
- 184
- Packing Style
- Tray
- peripherals
- POR, PWM, WDT, DMA, Voltage Detect
- Radiation Hardening
- No
- Ram Size
- 64KB
- Rohs Compliant
- Yes
- series
- STM32 F1
- Watchdog Timer
- Yes
- width
- 10.15mm