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Key Specs Summary(35)
- Core Architecture
- ARM
- Data Bus Width
- 32b
- frequency
- 72MHz
- height
- 0.785mm
- interface
- I2C, SPI, USB, CAN, IrDA, UART, USART, LIN
- Lead Free
- Lead Free
- length
- 5mm
- Max Frequency
- 72MHz
- Max Power Dissipation
- 308mW
- Max Supply Voltage
- 3.6V
- Memory Size
- 128KB
- Memory Type
- FLASH,
- Min Supply Voltage
- 2V
- Operating Temperature Max
- 85°C
- Operating Temperature Min
- -40°C
- Package Case
- FBGA, BGA64,8X8,20
- Lifecycle Status
- Active
- Number Of Adc Channels
- 16
- Number Of I2 C Channels
- 2
- Number Of I Os
- 51
- Number Of Programmable I O
- 51
- Number Of Spi Channels
- 2
- Number Of Timers Counters
- 4
- Oscillator Type
- Internal
- package
- FBGA, BGA64,8X8,20
- Package Quantity
- 640
- Packing Style
- Tray
- peripherals
- POR, PWM, WDT, DMA, Temp Sensor, I2C
- Radiation Hardening
- No
- Ram Size
- 20KB
- Reach Compliant
- No
- Rohs Compliant
- Yes
- series
- STM32 F1
- Watchdog Timer
- Yes
- width
- 5.15mm