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Key Specs Summary(18)
- features
- Advanced audio distribution profile, Classic audio, Hands-free profile
- grade
- Catalog
- How Product Uses On Device Intelligence To Deliver Faster More Efficient Decision Making Without Cloud Connectivity
- No
- Package Length
- 14mm
- Operating Temperature
- -30 ~ 85Degree Celsius
- package
- QFM
- Package Max Height
- 1.54mm
- Package Thickness
- 0.34mm
- Pin Count
- 35
- Pin Pitch
- 0.9mm
- security
- Secure communication
- Supported Wireless Technology
- 2.4 GHz, Bluetooth® Classic, Bluetooth® Dual-Mode, Bluetooth® LE
- type
- Module, Transceiver
- Type Of Cpu
- Arm® Cortex®-M3
- Type Of Supported Protocols
- Dual-mode Bluetooth
- Package Width
- 7mm
- Lifecycle Status
- NOT RECOMMENDED FOR NEW DESIGNS
- Product Family
- Wi-Fi products