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Key Specs Summary(34)
- Basic Package Type
- Lead-Frame SMT
- Package Height Mm
- 0.85
- jedec
- MO-187AA
- Lead Shape
- Gull-wing
- Package Length Mm
- 3
- Manufacturer Type
- Micropower Amplifier
- Mount Type
- Surface Mount
- Package Case
- Lead-Frame SMT
- Package Description
- Micro Small Outline Package
- Package Family Name
- MSOP
- Package Material
- Plastic
- pcb
- 8
- Pin Count
- 8
- Pin Pitch Mm
- 0.65
- Seated Plane Height Mm
- 1.1(Max)
- Package Width Mm
- 3
- Lifecycle Status
- Active
- Max Operating Supply Voltage
- 5.5
- Maximum Input Bias Current
- 0.00001@5V
- Maximum Input Offset Current
- 0.00001@5V
- Maximum Input Offset Voltage
- 0.8@5V
- Maximum Single Supply Voltage
- 5.5
- Maximum Supply Voltage Range
- 5.5 to 6
- Minimum Single Supply Voltage
- 1.5
- Number Of Channels Per Chip
- 2
- Operating Temperature Max
- 125
- Operating Temperature Min
- -40
- Output Type
- CMOS
- package
- Lead-Frame SMT
- Process Technology
- CMOS
- Rail To Rail
- Rail to Rail Input/Output
- type
- Micropower Amplifier
- Typical Gain Bandwidth Product
- 2.4
- Typical Single Supply Voltage
- 3|5