Ask your AI about TSV6293AIST — and the rest of your design
Connect PartsPlan once to Claude, ChatGPT or another AI, and it reads the manufacturer's original datasheets for every part in your BOM or schematic, not just this one — answering with the document and page number.
e.g. “Using PartsPlan, check the datasheets for my whole BOM, and give the TSV6293AIST ratings and package dimensions with the pages.”
Free: 300 calls a month · no card required
Key Specs Summary(34)
- Basic Package Type
- Lead-Frame SMT
- Package Height Mm
- 0.86
- jedec
- MO-187BA
- Lead Shape
- Gull-wing
- Package Length Mm
- 3
- Manufacturer Type
- Micropower Amplifier
- Mount Type
- Surface Mount
- Package Case
- Lead-Frame SMT
- Package Description
- Micro Small Outline Package
- Package Family Name
- MSOP
- Package Material
- Plastic
- pcb
- 10
- Pin Count
- 10
- Pin Pitch Mm
- 0.65
- Seated Plane Height Mm
- 1.1(Max)
- Package Width Mm
- 3
- Lifecycle Status
- Active
- Max Operating Supply Voltage
- 5.5
- Maximum Input Bias Current
- 0.00001@5V
- Maximum Input Offset Current
- 0.00001@5V
- Maximum Input Offset Voltage
- 1@5V
- Maximum Single Supply Voltage
- 5.5
- Maximum Supply Voltage Range
- 5.5 to 6
- Minimum Single Supply Voltage
- 1.5
- Number Of Channels Per Chip
- 2
- Operating Temperature Max
- 125
- Operating Temperature Min
- -40
- Output Type
- CMOS
- package
- Lead-Frame SMT
- Process Technology
- CMOS
- Rail To Rail
- Rail to Rail Input/Output
- type
- Micropower Amplifier
- Typical Gain Bandwidth Product
- 1.3
- Typical Single Supply Voltage
- 3|5