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Key Specs Summary(34)
- Basic Package Type
- Non-Lead-Frame SMT
- Package Height Mm
- 0.95(Max)
- jedec
- MO-220VEED-6
- Lead Shape
- No Lead
- Package Length Mm
- 3
- Manufacturer Type
- General Purpose Amplifier
- Mount Type
- Surface Mount
- Package Case
- Non-Lead-Frame SMT
- Package Description
- Quad Flat No Lead Package, Exposed Pad
- Package Family Name
- QFN
- Package Material
- Plastic
- pcb
- 16
- Pin Count
- 16
- Pin Pitch Mm
- 0.5
- Seated Plane Height Mm
- 0.9
- Package Width Mm
- 3
- Lifecycle Status
- Active
- Max Operating Supply Voltage
- 5.5
- Maximum Input Bias Current
- 0.00001@5V
- Maximum Input Offset Current
- 0.00001@5V
- Maximum Input Offset Voltage
- 1@5V
- Maximum Single Supply Voltage
- 5.5
- Maximum Supply Voltage Range
- 5.5 to 6
- Minimum Single Supply Voltage
- 2.7
- Number Of Channels Per Chip
- 4
- Operating Temperature Max
- 125
- Operating Temperature Min
- -40
- Output Type
- CMOS
- package
- Non-Lead-Frame SMT
- Process Technology
- CMOS
- Rail To Rail
- Rail to Rail Input/Output
- type
- General Purpose Amplifier
- Typical Gain Bandwidth Product
- 1.15
- Typical Single Supply Voltage
- 3|5