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Key Specs Summary(32)
- Basic Package Type
- Lead-Frame SMT
- Package Height Mm
- 1.65(Max)
- jedec
- MS-012AA
- Lead Shape
- Gull-wing
- Package Length Mm
- 5(Max)
- Manufacturer Type
- General Purpose Amplifier
- Mount Type
- Surface Mount
- Package Case
- Lead-Frame SMT
- Package Description
- Small Outline IC Narrow Body
- Package Family Name
- SOP
- Package Material
- Plastic
- pcb
- 8
- Pin Count
- 8
- Pin Pitch Mm
- 1.27
- Seated Plane Height Mm
- 1.75(Max)
- Package Width Mm
- 4(Max)
- Lifecycle Status
- Active
- Max Operating Supply Voltage
- ±18
- Maximum Dual Supply Voltage
- ±18
- Maximum Input Bias Current
- 0.0002@±15V
- Maximum Input Offset Current
- 0.0001@±15V
- Maximum Input Offset Voltage
- 6@±15V
- Maximum Supply Voltage Range
- 36 to 37
- Minimum Dual Supply Voltage
- ±3
- Number Of Channels Per Chip
- 2
- Operating Temperature Max
- 105
- Operating Temperature Min
- -40
- package
- Lead-Frame SMT
- Process Technology
- BiFET
- type
- General Purpose Amplifier
- Typical Dual Supply Voltage
- ±5|±9|±12|±15
- Typical Gain Bandwidth Product
- 4