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Key Specs Summary(23)
- Basic Package Type
- Non-Lead-Frame SMT
- Package Height Mm
- 1.5(Max)
- Lead Shape
- No Lead
- Package Length Mm
- 4.9
- Mount Type
- Surface Mount
- Operating Temperature Max
- 125
- Operating Temperature Min
- -40
- Package Case
- Non-Lead-Frame SMT
- Package Description
- Very Fine Quad Flat Package No Lead, Exposed Pad
- Package Family Name
- QFN
- Package Material
- Plastic
- pcb
- 8
- Pin Count
- 8
- Pin Pitch Mm
- 1.27
- Seated Plane Height Mm
- 1.75(Max)
- Package Width Mm
- 6
- Lifecycle Status
- Active
- Maximum Power Dissipation
- 2000
- Maximum Supply Current
- 2500
- Max Operating Supply Voltage
- 18
- Min Operating Supply Voltage
- 3
- package
- Non-Lead-Frame SMT
- Typical Operating Supply Voltage
- 3.3|5|9|12|15
Pages by item in this datasheet
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- Features
- 1 page
- Pin configuration
- 1 page
- Absolute maximum ratings
- 1 page
- Electrical characteristics
- 1 page
- Thermal information
- 1 page
- Application circuit
- 5 pages
- Package drawing
- 3 pages
- Layout
- 4 pages
- Ordering information
- 1 page
ST datasheet · 40 pages · 115 sections, 12 tables, 33 figuresAll items and pages through the MCP →