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Key Specs Summary(35)
- Basic Package Type
- Lead-Frame SMT
- Package Height Mm
- 1.65(Max)
- jedec
- MS-012AA
- Lead Shape
- Gull-wing
- Package Length Mm
- 5(Max)
- Mount Type
- Surface Mount
- Package Case
- Lead-Frame SMT
- Package Description
- Small Outline IC Narrow Body
- Package Family Name
- SOP
- Package Material
- Plastic
- pcb
- 8
- Pin Count
- 8
- Pin Pitch Mm
- 1.27
- Seated Plane Height Mm
- 1.75(Max)
- type
- LDO
- Package Width Mm
- 4(Max)
- accuracy
- ±2
- Junction To Ambient
- 112K/W
- Lifecycle Status
- Active
- Line Regulation
- 40mV
- Load Regulation
- 40mV
- Maximum Input Voltage
- 31
- Maximum Output Current
- 0.15
- Maximum Dropout Voltage Current
- 0.5@150mA
- Minimum Input Voltage
- 5.6
- Number Of Outputs
- 1
- Operating Temperature Max
- 150
- Operating Temperature Min
- -40
- Output Type
- Fixed
- Output Voltage
- 5
- package
- Lead-Frame SMT
- polarity
- Positive
- Reference Voltage
- 2.5(Typ)
- Special Features
- Current Limit|Short Circuit Protection|Thermal Shutdown Protection
- Typical Quiescent Current
- 0.055
Pages by item in this datasheet
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- Features
- 1 page
- Pin configuration
- 1 page
- Absolute maximum ratings
- 1 page
- Electrical characteristics
- 3 pages
- Thermal information
- 6 pages
- Application circuit
- 1 page
- Package drawing
- 4 pages
STMicroelectronics datasheet · 34 pages · 64 sections, 23 tables, 40 figuresAll items and pages through the MCP →