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Key Specs Summary(27)
- Basic Package Type
- Through Hole
- Contact Configuration
- Single
- Package Height Mm
- 6.6(Max)
- jedec
- TO-39
- Lead Shape
- Through Hole
- Mount Type
- Through Hole
- Number Of Elements Per Chip
- 1
- Package Case
- Through Hole
- Package Description
- Transistor Outline Package
- Package Diameter Mm
- 9.4(Max)
- Package Family Name
- TO-205-AF
- Package Material
- Metal
- pcb
- 3
- Pin Count
- 3
- Seated Plane Height Mm
- 6.6(Max)
- type
- PNP
- category
- Bipolar Power
- Maximum Collector Emitter Voltage
- 80
- Lifecycle Status
- Unconfirmed
- Maximum Power Dissipation
- 1000
- Maximum Collector Base Voltage
- 100
- Maximum Dc Collector Current
- 5
- Maximum Emitter Base Voltage
- 5.5
- Minimum Dc Current Gain
- 40@5A@5V|70@2.5A@5V|50@50mA@5V
- Operating Temperature Max
- 200
- Operating Temperature Min
- -65
- package
- Through Hole