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Key Specs Summary(35)
- Basic Package Type
- Through Hole
- Package Height Mm
- 21.1(Max)
- jedec
- TO-247
- Lead Shape
- Through Hole
- Package Length Mm
- 16.13(Max)
- Mount Type
- Through Hole
- Package Case
- Through Hole
- Package Description
- Transistor Outline Package
- Package Family Name
- TO-247
- Package Material
- Plastic
- pcb
- 3
- Pin Count
- 3
- Pin Pitch Mm
- 5.44
- Seated Plane Height Mm
- 25.57(Max)
- tab
- Tab
- Package Width Mm
- 5.21(Max)
- category
- Power MOSFET
- Channel Mode
- Enhancement
- Channel Type
- N
- Contact Configuration
- Single
- Maximum Continuous Drain Current
- 43.3
- Maximum Drain Source Voltage
- 650
- Lifecycle Status
- Active
- Maximum Power Dissipation
- 391000
- Maximum Drain Source Resistance
- 80@10V
- Maximum Gate Source Voltage
- 20
- Maximum Gate Threshold Voltage
- 4.5
- Number Of Elements Per Chip
- 1
- Operating Temperature Max
- 150
- Operating Temperature Min
- -40
- package
- Through Hole
- Process Technology
- CoolMOS
- Typical Gate Charge 10 V
- 161
- Typical Gate Charge Vgs
- 161@10V
- Typical Input Capacitance Vds
- 4440@100V