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Key Specs Summary(33)
- Basic Package Type
- Ball Grid Array
- Package Height Mm
- 0.4
- Lead Shape
- Ball
- Package Length Mm
- 0.76
- Mount Type
- Surface Mount
- Number Of Outputs
- 1
- Package Case
- Ball Grid Array
- Package Description
- Wafer Level Chip Scale Package
- Package Family Name
- BGA
- Package Material
- Plastic
- pcb
- 4
- Pin Count
- 4
- Pin Pitch Mm
- 0.4
- Seated Plane Height Mm
- 0.6
- type
- LDO
- Package Width Mm
- 0.76
- accuracy
- ±1
- Junction To Ambient
- 260°C/W
- Lifecycle Status
- Active
- Line Regulation
- 0.05%/V
- Load Regulation
- 0.002%/mA(Typ)
- Maximum Input Voltage
- 5.5
- Maximum Output Current
- 0.15
- Maximum Dropout Voltage Current
- 0.035@10mA|0.16@150mA
- Minimum Input Voltage
- 2.2
- Operating Temperature Max
- 125
- Operating Temperature Min
- -40
- Output Type
- Fixed
- Output Voltage
- 3.3
- package
- Ball Grid Array
- polarity
- Positive
- Special Features
- Current Limit|Short Circuit Protection|Thermal Protection
- Typical Dropout Voltage Current
- 0.01@10mA|0.105@150mA