EP2AGZ350FF35I3N부터 회로 전체까지, AI에게 물어보세요
Claude·ChatGPT 같은 AI에 PartsPlan을 한 번 연결하면, 이 부품만이 아니라 BOM·회로도에 든 부품 전부를 제조사 데이터시트 원문에서 찾아 문서와 쪽 번호까지 답합니다.
예: “내 BOM 전체 데이터시트를 확인하고, EP2AGZ350FF35I3N의 정격과 패키지 치수는 근거 쪽과 함께 알려 줘”
무료 월 300회 · 카드 등록 없음
주요 스펙 요약(41)
- Basic Package Type
- Ball Grid Array
- Family Name
- Arria® II GZ
- Package Height Mm
- 2.7
- jedec
- MS-034AAR-1
- Lead Shape
- Ball
- Package Length Mm
- 35
- Mount Type
- Surface Mount
- Package Case
- Ball Grid Array
- Package Description
- Flip Chip Fine Pitch Ball Grid Array
- Package Family Name
- BGA
- Package Material
- Plastic
- pcb
- 1152
- Pin Count
- 1152
- Pin Pitch Mm
- 1
- Seated Plane Height Mm
- 3.2
- Package Width Mm
- 35
- Dedicated Dsp
- 130
- Device Logic Cells
- 348500
- Device Number Of Dlls Plls
- 8
- Differential I O Standards Supported
- LVPECL|LVDS|HSTL-18|HSTL-15|HSTL-12
- Ethernet Macs
- 1
- External Memory Interface
- DDR2 SDRAM|DDR3 SDRAM|RLDRAM II|QDRII+SRAM
- Lifecycle Status
- LTB
- Maximum Number Of Serdes Channels
- 86
- Maximum Number Of User I Os
- 554
- Number Of Multipliers
- 1040 (18x18)
- Operating Temperature Max
- 100
- Operating Temperature Min
- -40
- package
- Ball Grid Array
- Pci Blocks
- 1
- Process Technology
- 40nm
- Program Memory Type
- SRAM
- programmability
- Yes
- Ram Bits
- 20772
- Single Ended I O Standards Supported
- LVTTL|LVCMOS
- Speed Grade
- 3
- Supported Ip Core
- 10 Gbps Ethernet MAC|10G Ethernet MACController (XGMAC)|PCI X Core|10/100/1000Mbps Full Duplex Ethernet MAC|PCI Express Cores
- Supported Ip Core Manufacture
- Altera/Mobiveil, Inc/Northwest Logic, Inc/MorethanIP/Northwest Logic, Inc
- Total Number Of Block Ram
- 36+1248
- Transceiver Blocks
- 16
- Transceiver Speed
- 6.375