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Microchip Technology SMBG16AHe3/TR7
SMBG16AHe3/TR7 image 2
수집 데이터Protection Devices

Microchip Technology(구 Microchip)

SMBG16AHe3/TR7

protection

주요 스펙 요약(26)

Basic Package Type
Lead-Frame SMT
Contact Configuration
Single
Direction Type
Uni-Directional
jedec
DO-215AA
Lead Shape
Gull-wing
Package Length Mm
4.57(Max)
Maximum Reverse Stand Off Voltage
16
Mount Type
Surface Mount
Package Case
Lead-Frame SMT
Package Description
SMD Plastic Package
Package Family Name
DO-215-AA
Package Material
Plastic
pcb
2
Pin Count
2
Pin Pitch Mm
2.54
Package Width Mm
3.94(Max)
Lifecycle Status
Active
Maximum Reverse Leakage Current
1
Maximum Clamping Voltage
26
Maximum Peak Pulse Current
23.1
Minimum Breakdown Voltage
17.8
Number Of Elements Per Chip
1
Operating Temperature Max
150
Operating Temperature Min
-65
package
Lead-Frame SMT
Peak Pulse Power Dissipation
600