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Key Specs Summary(33)
- Basic Package Type
- Non-Lead-Frame SMT
- Data Bus Width
- 64
- Device Core
- Xeon
- Family Name
- Xeon® Processor E3-1275 v2
- Instruction Set Architecture
- RISC
- Lead Shape
- No Lead
- Package Length Mm
- 37.5
- Maximum Speed
- 3500
- Mount Type
- Surface Mount
- Package Case
- Non-Lead-Frame SMT
- Package Description
- Flip-Chip Land Grid Array
- Package Family Name
- LGA
- Package Material
- Plastic
- pcb
- 1155
- Pin Count
- 1155
- Package Width Mm
- 37.5
- can
- 0
- Data Cache Size
- 32KB
- ethernet
- 0
- I2 C
- 0
- I2 S
- 0
- Instruction Cache Size
- 32KB
- Interface Type
- DMI/PECI
- Lifecycle Status
- Active
- Max Operating Supply Voltage
- 1.86
- Multiply Accumulate
- No
- Number Of Cpu Cores
- 4
- package
- Non-Lead-Frame SMT
- Process Technology
- 22nm
- spi
- 0
- uart
- 0
- usart
- 0
- usb
- 0