No Domestic Stock
Request a quote for this part and sellers will provide prices.
Key Specs Summary(32)
- Basic Package Type
- Ball Grid Array
- Family Name
- Spartan®-6 LX
- Package Height Mm
- 0.9
- Lead Shape
- Ball
- Package Length Mm
- 13
- Maximum Number Of User I Os
- 160
- Mount Type
- Surface Mount
- Package Case
- Ball Grid Array
- Package Description
- Chip Scale Ball Grid Array
- Package Family Name
- BGA
- Package Material
- Plastic
- pcb
- 225
- Pin Count
- 225
- Pin Pitch Mm
- 0.8
- Seated Plane Height Mm
- 1.4(Max)
- Package Width Mm
- 13
- Dedicated Dsp
- 16
- Device Logic Cells
- 9152
- Device Number Of Dlls Plls
- 6
- Lifecycle Status
- Active
- Number Of Multipliers
- 32 (18x18)
- Number Of Registers
- 11440
- Operating Temperature Max
- 85
- Operating Temperature Min
- 0
- package
- Ball Grid Array
- Process Technology
- 45nm
- Program Memory Type
- SRAM
- programmability
- Yes
- Ram Bits
- 576
- Speed Grade
- 1L
- Total Number Of Block Ram
- 32
- Transceiver Speed
- 3.2