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주요 스펙 요약(32)
- basic_package_type
- Ball Grid Array
- density
- 64M
- package_height_mm
- 0.73(Max)
- lead_shape
- Ball
- package_length_mm
- 10.1
- mount_type
- Surface Mount
- package_case
- Ball Grid Array
- package_description
- Very Thin Fine Pitch Ball Grid Array
- package_family_name
- BGA
- package_material
- Plastic
- pcb
- 60
- pin_count
- 60
- pin_pitch_mm
- 0.65
- seated_plane_height_mm
- 1.1(Max)
- type
- SDRAM
- package_width_mm
- 6.4
- address_bus_width
- 14
- data_bus_width
- 16
- density_in_bits
- 67108864
- lifecycle_status
- Active
- max_operating_supply_voltage
- 3.6
- maximum_access_time
- 6|5
- maximum_clock_rate
- 166
- maximum_operating_current
- 75
- min_operating_supply_voltage
- 3
- number_of_internal_banks
- 4
- number_of_words_per_bank
- 1M
- operating_temperature_max
- 85
- operating_temperature_min
- -40
- organization
- 4Mx16
- package
- Ball Grid Array
- typical_operating_supply_voltage
- 3.3