📦이미지 준비중
주요 스펙 요약(32)
- basic_package_type
- Ball Grid Array
- density
- 1G
- package_height_mm
- 0.76
- lead_shape
- Ball
- package_length_mm
- 11.4
- mount_type
- Surface Mount
- package_case
- Ball Grid Array
- package_description
- Fine Pitch Ball Grid Array
- package_family_name
- BGA
- package_material
- Plastic
- pcb
- 60
- pin_count
- 60
- pin_pitch_mm
- 0.8
- seated_plane_height_mm
- 1.1
- type
- DDR2 SDRAM
- package_width_mm
- 8
- address_bus_width
- 17
- data_bus_width
- 8
- density_in_bits
- 1073741824
- lifecycle_status
- Obsolete
- max_operating_supply_voltage
- 1.9
- maximum_access_time
- 0.45
- maximum_clock_rate
- 667
- maximum_operating_current
- 145
- min_operating_supply_voltage
- 1.7
- number_of_internal_banks
- 8
- number_of_words_per_bank
- 16M
- operating_temperature_max
- 95
- operating_temperature_min
- -40
- organization
- 128Mx8
- package
- Ball Grid Array
- typical_operating_supply_voltage
- 1.8