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주요 스펙 요약(33)
- basic_package_type
- Through Hole
- category
- Power MOSFET
- contact_configuration
- Single
- package_height_mm
- 18.9
- lead_shape
- Through Hole
- package_length_mm
- 15.6
- mount_type
- Through Hole
- package_case
- Through Hole
- package_description
- Transistor Outline Package
- package_family_name
- TO-3P
- package_material
- Plastic
- pcb
- 3
- pin_count
- 3
- pin_pitch_mm
- 5.45
- tab
- Tab
- package_width_mm
- 4.8
- channel_mode
- Enhancement
- channel_type
- N
- lifecycle_status
- Active
- material
- Si
- maximum_continuous_drain_current
- 21
- maximum_drain_source_resistance
- 360@10V
- maximum_drain_source_voltage
- 600
- maximum_gate_source_voltage
- ±30
- maximum_gate_threshold_voltage
- 4.5
- maximum_power_dissipation
- 150000
- number_of_elements_per_chip
- 1
- operating_temperature_max
- 150
- operating_temperature_min
- -55
- package
- Through Hole
- typical_gate_charge_10_v
- 67
- typical_gate_charge_vgs
- 67@10V
- typical_input_capacitance_vds
- 2600@25V