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주요 스펙 요약(32)
- basic_package_type
- Non-Lead-Frame SMT
- chip_density
- 2G
- package_height_mm
- 30
- lead_shape
- No Lead
- package_length_mm
- 133.35
- main_category
- DRAM Module
- maximum_clock_rate
- 1066
- module_type
- 240RDIMM
- mount_type
- Socket
- package_case
- Non-Lead-Frame SMT
- package_description
- Registered Dual In Line Memory Module
- package_family_name
- DIM
- pcb
- 240
- pin_count
- 240
- pin_pitch_mm
- 1
- total_density
- 8Gbyte
- cas_latency
- 7
- chip_configuration
- 256Mx8
- chip_package_type
- FBGA
- data_bus_width
- 72
- ecc_support
- Yes
- lifecycle_status
- Obsolete
- max_operating_supply_voltage
- 1.575
- min_operating_supply_voltage
- 1.425
- number_of_chip_per_module
- 36
- number_of_ranks
- Quad
- operating_temperature_max
- 85
- operating_temperature_min
- 0
- organization
- 1Gx72
- package
- Non-Lead-Frame SMT
- subcategory
- DDR3 SDRAM
- typical_operating_supply_voltage
- 1.5