📦이미지 준비중
주요 스펙 요약(33)
- basic_package_type
- Non-Lead-Frame SMT
- data_bus_width
- 64
- device_core
- Xeon
- family_name
- Xeon® Processor X5272
- package_height_mm
- 4.3(Max)
- lead_shape
- No Lead
- package_length_mm
- 37.55(Max)
- maximum_speed
- 3400
- mount_type
- Surface Mount
- package_case
- Non-Lead-Frame SMT
- package_description
- Flip-Chip Land Grid Array
- package_family_name
- LGA
- package_material
- Plastic
- pcb
- 771
- pin_count
- 771
- package_width_mm
- 37.55(Max)
- can
- 0
- data_cache_size
- 32KB
- ethernet
- 0
- i2_c
- 0
- i2_s
- 0
- instruction_cache_size
- 32KB
- interface_type
- PECI
- lifecycle_status
- Obsolete
- max_operating_supply_voltage
- 1.155|1.35|1.605
- multiply_accumulate
- No
- number_of_cpu_cores
- 2
- package
- Non-Lead-Frame SMT
- process_technology
- 45nm
- spi
- 0
- uart
- 0
- usart
- 0
- usb
- 0