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주요 스펙 요약(27)
- core_architecture
- Blackfin
- data_bus_width
- 16b
- frequency
- 600MHz
- height
- 1.26mm
- interface
- SPI, CAN, SSP, UART
- lead_free
- Contains Lead
- length
- 17mm
- max_frequency
- 100MHz
- max_supply_voltage
- 3.6V
- memory_size
- 132KB
- memory_type
- ROM
- min_supply_voltage
- 800mV
- mount_type
- Surface Mount
- operating_temperature_max
- 85°C
- operating_temperature_min
- -40°C
- package_case
- LFBGA, BGA208,20X20,32
- lifecycle_status
- Active
- number_of_i_os
- 48
- package
- LFBGA, BGA208,20X20,32
- package_quantity
- 90
- packing_style
- Tray
- radiation_hardening
- No
- ram_size
- 32KB
- reach_compliant
- No
- rohs_compliant
- Yes
- series
- Blackfin®
- width
- 17mm