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주요 스펙 요약(12)
데이터시트 대조일치 1검토 1
- Data Rate검증
- 20Mbps
- duplex
- Half-Duplex
- Esd Protect
- ±10kV
- features
- Tx/Rx enable;Enable shutdown;Hot-swap protection;Overcurrent Protection;Automatic fault recovery;Thermal shutdown protection
- Number Of Drivers
- 1
- Number Of Nodes
- 224
- Number Of Receivers
- 1
- Operating Temperature
- -40℃~+125℃
- package검토
- SOIC-16W데이터시트: SOIC_W (p.1)
- Quiescent Supply Current
- -
- type
- Transceiver
- Voltage Supply
- 1.7V~5.5V;3V~5.5V
데이터시트 추출 정보
데이터시트에서 직접 추출한 사실 (출처 명시)핀 배치 · SOIC_W · 16 핀
| # | Name | Type | Function |
|---|---|---|---|
| 1 | VDD1 | power in | Flexible Primary Side Power Supply (1.7V to 5.5V) |
| 2 | GND1 | passive | Ground 1, Logic Side |
| 3 | RxD | output | Receiver Output Data |
| 4 | RE | input | Receiver Enable Input (active low) |
| 5 | DE | input | Driver Output Enable |
| 6 | TxD | input | Transmit Data Input |
| 7 | NIC | no connect | Not Internally Connected |
| 8 | GND1 | passive | Ground 1, Logic Side |
| 9 | GND2 | passive | Isolated Ground 2 for Bus Side |
| 10 | NIC | no connect | Not Internally Connected |
| 11 | NIC | no connect | Not Internally Connected |
| 12 | A | bidirectional | Noninverting Driver Output/Receiver Input |
| 13 | B | bidirectional | Inverting Driver Output/Receiver Input |
| 14 | NIC | no connect | Not Internally Connected |
| 15 | GND2 | passive | Isolated Ground 2 for Bus Side |
| 16 | VDD2 | power in | Isolated Side Power Supply (3.0V to 5.5V) |
출처 1 ↗추출 신뢰도: 높음
패키지 정보
- jedec
- RW-16
- package
- SOIC_W
절대 최대 정격
| VDD1 to GND1 | -0.5 to +7.0V | |
| VDD2 to GND2 | -0.5 to +6.0V | |
| Driver Output/Receiver Input Voltage (A,B) to GND2 | -60 to +60V |
권장 동작 조건
| Ambient Operating Range (TA) | -40 to +125°C | |
| Primary VDD1 supply | 1.7 to 5.5V | |
| Isolated VDD2 supply | 3.0 to 5.5V |
열 특성
- unit
- °C/W
- theta ja
- 63.9
등급 · 신뢰성
- esd cdm
- 1250
- esd hbm
- ≥±4000
오더링 코드
- BRWZ
- SOIC_W package