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주요 스펙 요약(33)
- basic_package_type
- Ball Grid Array
- family_name
- Virtex®-6 CXT
- package_height_mm
- 2.5(Max)
- lead_shape
- Ball
- package_length_mm
- 29
- maximum_number_of_user_i_os
- 360
- mount_type
- Surface Mount
- number_of_registers
- 93120
- package_case
- Ball Grid Array
- package_description
- Flip Chip Ball Grid Array
- package_family_name
- BGA
- package_material
- Plastic
- pcb
- 784
- pin_count
- 784
- seated_plane_height_mm
- 3.1(Max)
- package_width_mm
- 29
- dedicated_dsp
- 288
- device_logic_cells
- 74496
- ethernet_macs
- 1
- lifecycle_status
- Active
- number_of_multipliers
- 288 (25x18)
- operating_temperature_max
- 85
- operating_temperature_min
- 0
- package
- Ball Grid Array
- pci_blocks
- 1
- process_technology
- 40nm
- program_memory_type
- Flash
- programmability
- Yes
- ram_bits
- 5616
- speed_grade
- 1
- total_number_of_block_ram
- 156
- transceiver_blocks
- 12
- transceiver_speed
- 3.75