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주요 스펙 요약(33)
- basic_package_type
- Ball Grid Array
- family_name
- Spartan®-6 LX
- package_height_mm
- 1
- jedec
- MS-034AAF-1
- lead_shape
- Ball
- package_length_mm
- 17
- mount_type
- Surface Mount
- package_case
- Ball Grid Array
- package_description
- Fine Pitch Thin Ball Grid Array
- package_family_name
- BGA
- package_material
- Plastic
- pcb
- 256
- pin_count
- 256
- pin_pitch_mm
- 1
- seated_plane_height_mm
- 1.4
- package_width_mm
- 17
- dedicated_dsp
- 32
- device_logic_cells
- 14579
- device_number_of_dlls_plls
- 6
- lifecycle_status
- Active
- maximum_number_of_user_i_os
- 186
- number_of_multipliers
- 64 (18x18)
- number_of_registers
- 18224
- operating_temperature_max
- 100
- operating_temperature_min
- -40
- package
- Ball Grid Array
- process_technology
- 45nm
- program_memory_type
- SRAM
- programmability
- Yes
- ram_bits
- 576
- speed_grade
- 3
- total_number_of_block_ram
- 32
- transceiver_speed
- 3.2