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주요 스펙 요약(35)
- basic_package_type
- Ball Grid Array
- package_height_mm
- 1.35(Max)
- lead_shape
- Ball
- package_length_mm
- 19
- mount_type
- Surface Mount
- package_case
- Ball Grid Array
- package_description
- Chip Scale Ball Grid Array
- package_family_name
- BGA
- package_material
- Plastic
- package_orientation
- Yes
- package_orientation_marking_type
- Dot
- pcb
- 484
- pin_count
- 484
- pin_pitch_mm
- 0.8
- seated_plane_height_mm
- 1.8(Max)
- package_width_mm
- 19
- dedicated_dsp
- 180
- device_logic_cells
- 101261
- device_number_of_dlls_plls
- 18
- external_memory_interface
- DDR SDRAM|DDR2 SDRAM|DDR3 SDRAM|LPDDR SDRAM
- family_name
- Spartan®-6 LX
- lifecycle_status
- Active
- maximum_number_of_user_i_os
- 338
- number_of_multipliers
- 360 (18x18)
- number_of_registers
- 126576
- operating_temperature_max
- 85
- operating_temperature_min
- 0
- package
- Ball Grid Array
- process_technology
- 45nm
- program_memory_type
- SRAM
- programmability
- Yes
- ram_bits
- 4824
- speed_grade
- 1L
- total_number_of_block_ram
- 268
- transceiver_speed
- 3.2